Tesis de maestría / master thesis

Re-entrant honeycomb and isogrid lattices in planar and curved surfaces: effective mechanical compressive properties

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This work proposes the analysis of the deformation and failure mechanisms of metamaterials in planar and cylindrical lattices with two topologies. Metamaterial research usually focuses on their design, manufacturing process, and characterization, but it has a noticeable window of opportunity for non-planar external geometries. Thanks to the development of additive manufacturing (AM), many possibilities have opened with respect to the fabrication of these metamaterials. The importance of studying non-planar geometries derives from the fact that most experimental analyses cover only conventional shapes such as cubes or planes. Non-planar structures, such as cylindrical and curved lattices, provide a more realistic scenario of metamaterial applications, and now that there is a way to fabricate them, it’s possible to further research the design of these structures and their characterization. Mechanical tests are proposed to analyze the stiffness and compression behavior of the structures. By subjecting the planar and cylindrical structures to compressive forces it’s possible to study how the topologies and their parameters have an effect on the energy absorption. By normalizing the results, it will be possible to compare them.

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El usuario tiene la obligación de utilizar los servicios y contenidos proporcionados por la Universidad, en particular, los impresos y recursos electrónicos, de conformidad con la legislación vigente y los principios de buena fe y en general usos aceptados, sin contravenir con su realización el orden público, especialmente, en el caso en que, para el adecuado desempeño de su actividad, necesita reproducir, distribuir, comunicar y/o poner a disposición, fragmentos de obras impresas o susceptibles de estar en formato analógico o digital, ya sea en soporte papel o electrónico. Ley 23/2006, de 7 de julio, por la que se modifica el texto revisado de la Ley de Propiedad Intelectual, aprobado

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